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조영달 교수 연구팀, 퀀텀 방열- 반도체 패키징의 새로운 지평을 열다
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- 전기전자컴퓨터공학부
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- 148
- Registraion Date
- 2022-07-18
연구39.조영달 교수 연구팀, 퀀텀 방열- 반도체 패키징의 새로운 지평을 열다.pdf
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